FUTURA TTT celebrates 50 years of experience in adhesive product converting at ABS Europe 2026
21 September 2026
DELO has expanded its range of solutions for consumer electronics assembly with new Super-Low-Temperature (SLT) curing adhesives, designed to cure at temperatures as low as 45 °C.
The new technology is part of the company’s DUALBOND LT family and is aimed at manufacturers looking to reduce thermal stress during the assembly of increasingly temperature-sensitive electronic components.
Curing in 10 minutes at 60 °C
According to DELO, the new SLT adhesives can achieve full curing in 10 minutes at 60 °C or in approximately one hour at 45 °C.
The process is based on the dual-curing approach used across the DUALBOND LT family. A brief exposure to UV or visible light initially fixes the components in position within seconds. This is followed by a low-temperature thermal curing step that provides the required mechanical strength and long-term reliability.
Lower thermal stress on electronic components
The ability to complete the curing process at lower temperatures is one of the key features of the new adhesive technology.
Conventional thermal curing processes used in consumer electronics assembly can require temperatures of around 80 °C, or curing times of 90 to 120 minutes at 60 °C.
DELO says that curing at 60 °C for 10 minutes can also enable manufacturers to use inline heat tunnels rather than batch ovens. Depending on the production setup, this can facilitate the integration of the curing stage directly into the assembly line.
Reduced component deformation
Another benefit highlighted by DELO concerns thermal stress on assembled components. Simulations conducted by the company reportedly showed reduced component deformation when curing at 45 °C compared with higher temperatures.
This can be particularly relevant for compact electronic modules, where tight dimensional tolerances and heat-sensitive materials can make thermal processing more challenging.
With its SLT adhesives, DELO is therefore combining rapid fixation, low-temperature processing and full curing in a solution designed for consumer electronics assembly applications.
Industry professionals will meet at ABS Europe 2026 – Adhesives Bonding & Sealants, the first event dedicated to adhesives, glues, sealants, foams, tapes, resins, coatings, laminates and films in Italy and the Mediterranean region, taking place from October 27 to 29, 2026, at Vicenza Exhibition Center.
