Fraunhofer IAP Develops Pressure-Activated Microencapsulated Two-Component Adhesives

A new microencapsulation-based technology could open up interesting opportunities for industrial bonding and assembly processes. The Fraunhofer Institute for Applied Polymer Research (IAP), located at Potsdam Science Park, has developed a two-component adhesive system activated by pressure at room temperature, eliminating the need for additional heating and subsequent curing stages.

The institute is currently seeking industrial and research partners interested in contributing components, support materials, and assembly processes to initiate full-scale application testing.

The technology is based on microcapsules that separately contain the components of a two-component adhesive. As long as the capsules remain intact, the system stays stable and inactive. When a specific pressure is applied during assembly, the capsules rupture and release the components, which come into contact and initiate the crosslinking process directly along the bonding line.

“You can think of the microcapsules as many tiny adhesive reservoirs,” explains Christian Neumann, researcher at Fraunhofer IAP.

One of the most significant features of the system is its ability to complete crosslinking at room temperature. This removes the need for additional process steps such as heating or dedicated curing cycles, offering potential advantages in terms of process simplification and reduced energy consumption.

The Challenge of Encapsulating Reactive Materials

Developing the system required addressing a major technical challenge: the encapsulation of highly reactive materials. Two-component adhesives can interact with the substances used to form the capsule shell, potentially compromising their stability and effectiveness.

According to Fraunhofer IAP, researchers successfully developed a coating chemistry capable of keeping adhesive components stable over time while ensuring adequate storage performance, processability, and controlled release during the pressing stage.

The approach also offers advantages in terms of handling and operational safety. Since the reactive components are released only during assembly, there is less need to handle exposed adhesives during standard production operations. For industrial applications, this could reduce direct operator contact with reactive substances.

At the same time, researchers are focusing on the development of isocyanate-free formulations using acrylic- and epoxy-based adhesive systems. This choice could make the technology particularly attractive for industries shifting formulation development toward alternatives to isocyanates.

Textile Carriers for Large-Area Bonding

Fraunhofer IAP is also working on integrating the microcapsules into sheet-based carrier materials, transforming the adhesive into an intermediate layer that can be easily handled during production. Potential carriers include technical textiles, fiber meshes, and other sheet materials. The goal is to create a system that can be positioned directly on the component and activated only during the joining process.

According to researchers, this approach could be particularly attractive for large-area bonding applications or situations where conventional dispensing systems are technically complex or economically inefficient.

Potential application sectors identified by the institute include automotive battery pack assembly, mechanical engineering, electronic component manufacturing, and the production of microstructured components featuring small-scale channels.

To accelerate development toward industrial applications, Fraunhofer IAP is seeking companies interested in testing the technology through real-world application trials. The institute considers collaborations especially strategic with organizations aiming to simplify assembly processes, improve adhesive handling safety, or integrate bonding more efficiently into existing production workflows.

These activities will also benefit from the manufacturing capabilities of the Fraunhofer Pilot Center for Polymer Synthesis and Processing (PAZ), where microcapsules can be produced in volumes reaching several tons, enabling testing under conditions close to industrial-scale production.

Industry professionals will gather at the ABS Europe 2026-Adhesives Bonding & Sealants, the first event dedicated to adhesives, glues, sealants, foams, tapes, resins, coatings, laminates, and films in Italy and the Mediterranean region, scheduled to take place from October 27–29, 2026, at Fiera di Vicenza.

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