Main topics (provisional):

• Innovative formulation approaches from leading global manufacturers
• Hot melt adhesives
• High-performance glues: new developments and solutions
• Adhesive labels and RFiD, NFC Tags
• Converting machines: enhancing adhesion and flexibility

• Isocyanate-free 2K polyurethane adhesives

• CNSL-based resins and curing agents: bio-based alternatives for epoxy adhesives

• Reactive modifiers such as liquid polybutadienes: enhancing adhesion and flexibility

• Resins: hybrid technologies for solvent- and isocyanate-free sealants